Spirox Launches High-Speed TGV Crack Inspection System for Glass Substrates
Spirox has introduced a new high-speed TGV crack inspection system designed for high-volume glass substrate inspection. The system aims to enhance production line efficiency.
HSINCHU, September 8, 2026 – Spirox, a Taiwanese manufacturer of semiconductor components, has unveiled a new high-speed TGV (Through-Glass Via) crack inspection system. The system is engineered to meet the demand for precise inspection of high-volume glass substrates, particularly for next-generation AI and HPC (High-Performance Computing) applications.
At an Advanced Packaging Technology Forum hosted by Spirox, experts from companies including Corning and DNP shared insights on glass core technology, TGV advancements, reliability, and inspection techniques. Such sophisticated inspection systems are crucial for manufacturing glass substrates increasingly utilized in packaging solutions for AI and HPC chips. TGV technology facilitates the production of smaller and more efficient components.
The new Spirox system is intended to accelerate and improve the inspection process for glass substrates, a critical factor for manufacturers in the rapidly evolving electronics market. The combination of speed and precision is expected to reduce manufacturing costs and enhance product quality. The inspection system supports high-volume production, essential for mass-market applications.
This launch aligns with a period of significant growth in demand for advanced semiconductor materials and technologies. Spirox's investment in research and development aims to solidify its competitive standing in the global market, providing solutions that support the advancement of next-generation computing technologies.