Supermicro Expands Liquid Cooling Portfolio for AI and HPC Data Centers
Super Micro Computer, Inc. has expanded its liquid cooling solutions with new rear door heat exchangers. These additions strengthen the company's end-to-end offerings for high-density AI and HPC infrastructure cooling.
San Jose, California – Super Micro Computer, Inc. (NASDAQ: SMCI), a provider of complete IT solutions for AI, enterprise, storage, and 5G/Edge with Data Center Building Block Solutions® (DCBBS), announced an expansion of its portfolio with Rear Door Heat Exchangers (RDHx). These additions enhance the company's end-to-end liquid cooling solutions designed for high-density AI and High-Performance Computing (HPC) infrastructure.
The expanded portfolio features ten models capable of cooling capacities ranging from 10 kW to 120 kW per rack. This allows both new and existing data centers to implement liquid cooling with minimal facility disruption. The solutions are compatible with standard EIA, ORv3, and MGX racks.
According to the company, these RDHx solutions enable higher compute density and improved cooling efficiency for AI and HPC workloads. They can also be integrated with Supermicro's Direct-to-Chip (D2C) liquid cooling technologies as part of the broader Data Center Building Block Solutions® (DCBBS) offering.
The rack-specific cooling capacities range from 10 kW to 120 kW, providing flexibility for data centers of varying sizes and requirements. The solutions also include intelligent management software for real-time monitoring of temperature, pressure, and flow rates.
Supermicro offers these solutions as part of its DCBBS program, which includes rack-scale infrastructure, power and cooling management, and global deployment services. The aim is to simplify the customer procurement process and accelerate system deployment.