Supermicro Expands Open Compute Project Portfolio for AI Datacenter Integration
Supermicro has introduced an expanded Open Compute Project (OCP) portfolio designed to accelerate AI datacenter deployments. The offering includes integrated rack-scale solutions from servers to cooling and power infrastructure.
San Jose, Calif. – Super Micro Computer, Inc. has announced an expanded portfolio of Open Compute Project (OCP) solutions aimed at accelerating the deployment of AI datacenters. The new offering utilizes the company's Data Center Building Block Solutions (DCBBS) concept to simplify and speed up the construction of AI infrastructure.
The portfolio includes OCP Accepted™ systems, ORv3 and ORW racks, along with 48V DC power supplies, networking solutions, and liquid cooling. These components are designed to enable higher compute density in both existing and new datacenters. The solutions cover everything from the compute units and cooling systems to management software, allowing for comprehensive control.
Charles Liang, President and CEO of Supermicro, highlighted that the rise of AI is redefining datacenter design. Through DCBBS, the company aims to provide customers with integrated infrastructure that includes compute, networking, power, and cooling solutions. This comprehensive approach reduces time to market and time to operation.
New solutions, such as the ORv3 and ORW racks, employ a centralized 48V DC busbar instead of server-specific power supplies. This enables more efficient cooling, including Supermicro's DLC-2 Direct-to-Chip liquid cooling, as well as rear-door heat exchangers (RDHx) on the rack. These cooling solutions can handle thermal loads up to 120 kW, facilitating higher server density without modifications to datacenter air conditioning systems.