Synopsys and TSMC Partner to Accelerate AI Systems Development
Synopsys and TSMC have announced new collaborations aimed at accelerating the development of AI and high-performance computing systems. The partnership focuses on AI-assisted design workflows and advanced packaging technologies.
Synopsys and TSMC are expanding their collaboration to accelerate the development of next-generation AI, high-performance computing (HPC), and semiconductor systems. The companies are focusing on AI-powered EDA (Electronic Design Automation) workflows, advanced packaging solutions, and IP core development, enabling more efficient design of complex chips.
The new innovations span TSMC's latest process technologies, such as A14, providing certified design flows that accelerate readiness for next-generation AI and HPC applications. The collaboration on agentic AI workflows aims to automate and improve productivity for complex analog, digital, and multi-die designs.
Additionally, the partnership supports TSMC's CoWoS® technology for multi-die designs, addressing power integrity and thermal requirements for AI systems. Collaboration on TSMC-COUPE™ also aims to streamline the development and verification of co-packaged optics.
Synopsys and TSMC have also expanded their 2nm IP portfolio and achieved successful tape-out milestones for PCIe 7.0 and HBM4, among others. These efforts accelerate the development of differentiated products for AI, data center, edge computing, and automotive applications.