Teledyne e2v Secures European Aerospace Certification

Teledyne e2v's semiconductor manufacturing facility in Grenoble, France, has become the first in Europe to achieve MIL-PRF-38535 Class Y certification. Awarded by the U.S. Defense Logistics Agency (DLA), this certification is globally recognized as the highest standard for quality and reliability in ceramic, non-hermetically sealed Flip-Chip microcircuits for aerospace and defense (A&D) applications.

The certification, also known as QML Class Y, signifies a significant commitment to rigorous quality control. Teledyne e2v has also obtained QML Class V certification for its hermetically sealed ceramic Flip-Chip microcircuits. The company collaborated with the DLA and NASA to help define the QML Class Y requirements and now holds AS9100 and QML Classes Q, V, and Y site certifications.

This achievement allows Teledyne e2v to meet the growing demand for Flip-Chip packaging solutions in the A&D sectors. The company previously held QML Class Q and V certifications for wire-bonded devices.

Laurent Monge, President of Semiconductors and General Manager at Teledyne e2v's Grenoble site, stated the certification is a testament to the team's efforts and investment. The company also announced the availability of its Industrialization and Manufacturing Services, offering advanced semiconductor packaging solutions.