Tomocube Launches HT-T1 Desktop for 3D Defect Analysis of Glass Substrates

Daejeon, South Korea – Tomocube, a company specializing in non-destructive 3D inspection and metrology, has launched the HT-T1 Desktop (HT-T1D). This compact holotomography system provides high-resolution, non-destructive 3D defect analysis for glass substrates, a key material in next-generation semiconductor packaging.

The HT-T1D is optimized for inspection and metrology workflows involving glass substrates. When conventional in-line inspection tools, such as automated optical inspection (AOI) systems, flag a potential defect, the HT-T1D utilizes these coordinates to reconstruct and analyze the interior of the glass substrate in three dimensions. This allows for precise resolution of the position, morphology, and depth profile of internal defects that might not be detectable through surface inspection alone.

Glass substrates and glass interposers are increasingly vital for advanced packaging applications like AI accelerators and High Bandwidth Memory (HBM). As these substrates move towards mass production, manufacturers face challenges in identifying micro-defects that can arise during complex fabrication steps like laser drilling and etching. Since a single critical defect can render an entire unit unusable, rapid translation of inspection data into process improvements is crucial for production line stability.

The system employs Tomocube's holotomography technology to visualize the 3D refractive index distribution within glass with high sensitivity. As the measurement is entirely non-destructive, the same location can be repeatedly examined across successive process stages. This significantly accelerates the understanding of defect formation and propagation, reducing analysis time from days or weeks to minutes and enabling early intervention before costly downstream processes.

Tomocube also introduced its TomoAnalysis MI (TAMI) software platform, designed for quantitative 3D data analysis and structured reporting. TAMI ensures a streamlined workflow from R&D analysis to production-line review by supporting data from both the HT-T1D and the planned HT-T1M in-line module.