TSMC Plans Five New Advanced Packaging Factories in Taiwan
According to information from the semiconductor supply chain, TSMC plans to build five new advanced chip packaging factories in the Kaohsiung Science Park.
Taiwan Semiconductor Manufacturing Company (TSMC) intends to expand its advanced chip packaging capacity by constructing five new factories in the Kaohsiung Science Park, reported Liberty Times citing Taiwanese sources.
The expansion addresses a surge in demand, particularly for advanced packaging technologies like chip-on-wafer-on-substrate (CoWoS), required by tech giants including Nvidia, AMD, and Apple.
Despite TSMC's significant production expansions, current capacity struggles to fully meet the long-term market supply gap.
The Kaohsiung Science Park already has P1 and P2 advanced packaging plants planned, with P1 operational and P2 in equipment installation. Phase two includes P3, P4, and P5, with completion targeted by 2031.
With the proposed five additional factories in phase three, the total number of TSMC packaging plants in the Kaohsiung Science Park will reach ten. The expansion plan requires a public comment period and feasibility studies before proceeding.