Verda and Compal expand AI infrastructure manufacturing partnership

Verda and Compal Electronics have announced an expanded collaboration aimed at accelerating the global deployment of AI cloud infrastructure. The partnership, detailed at GTC Berlin 2026, combines Verda’s specialized cloud operations with Compal’s manufacturing capabilities and server engineering expertise.

To support the expansion, Compal is scaling its production capacity at facilities in Daxi, Taiwan, and within the United States. This regional approach is intended to enhance supply chain resilience and reduce deployment times for AI infrastructure across EMEA, Asian, and North American markets.

The collaboration centers on the deployment of Compal’s SGX30-2 server systems, which utilize NVIDIA HGX B300 technology featuring eight NVIDIA Blackwell Ultra GPUs. These systems provide the high-density computing power required for Verda’s growing cloud AI workloads.

Verda CTO Arturs Polis described the partnership as a necessary step to meet operational scaling goals over the next two years. Alan Chang, vice president of Compal’s Infrastructure Solutions Business Group, stated that the integration of engineering and manufacturing supports the industry shift from initial innovation to large-scale production deployments.