Visitech Launches 1-Micron Maskless Photohead for Advanced Packaging
Visitech has released its next-generation 1µm L/S photohead, the LLS1000. This enables tool makers to develop custom direct write/imaging solutions for large substrate packaging needs.
Norwegian company Visitech has announced the launch of its new generation 1-micron L/S photohead, model LLS1000. The device is designed to enable the development of custom direct write and imaging solutions for large substrates, a critical aspect of advanced packaging.
The new photohead allows tool manufacturers to create tailored systems that meet the demands of packaging large circuit boards and other substrates. This technology is particularly significant in the semiconductor industry, where precision and efficiency in packaging processes are paramount.
Visitech states that the LLS1000 offers enhanced resolution and flexibility compared to previous models. The company believes this advancement will support manufacturers in meeting the growing demand for high-quality and complex packaging solutions.
The introduction of the LLS1000 aims to accelerate the development of new packaging technologies and improve the efficiency of production processes within an industry that continuously requires smaller and more capable components.