xFusion Presents AI Data Center Solutions at OCP Global Summit

xFusion presented its latest AI computing infrastructure at the Open Compute Project (OCP) Global Summit in San Jose. The company highlighted its solutions addressing the escalating challenges in cooling, power supply, and networking for next-generation AI data centers.

The company demonstrated liquid-cooled rack-scale systems, Super Node architecture, and next-generation high-voltage DC solutions. Arthur Wang, Director of Product Management at xFusion, delivered a keynote introducing a new framework for measuring data center value. This framework, WATT → FLOPS → TOKEN → AGENT → VALUE, assesses the efficiency of converting electrical power into tangible business outcomes.

xFusion's offerings target three critical areas. Liquid cooling, capable of handling over 4000 watts per chip, addresses rising heat density. The company is also developing 800V high-voltage DC (HVDC) solutions to enhance efficiency and reduce losses at megawatt-level power densities. For networking, xFusion leverages optical interconnects, such as Co-Packaged Optics (CPO), with its DaYu 2.0 Super Node, supporting up to 128 XPUs per rack.

The synergy of these three shifts forms xFusion's "compute power synergy" approach, optimizing energy flow from the grid to the chip. The company emphasizes its commitment to open standards and global collaboration to scale AI infrastructure from cloud to edge. xFusion aims to drive open, efficient infrastructure that transforms every watt into measurable value.