xFusion Showcases AI Infrastructure at OCP Global Summit

xFusion is participating in the Open Compute Project (OCP) Global Summit 2026 in San Jose, showcasing its latest AI infrastructure. The company is featuring rack-scale systems with liquid cooling, supernode architectures, and high-voltage DC power solutions.

A keynote address also discussed how to measure AI data center throughput. Arthur Wang, xFusion's Director of Product Management, introduced a new framework for converting power into business value, progressing from watts to FLOPS, AI tokens, and ultimately agents delivering measurable value.

"In the era of agents, competitiveness isn't about how many chips you have," said Wang. "It's about how much real business value can be extracted from every watt and every heat joule."

Achieving this vision requires simultaneous advancements in three areas: cooling, power, and interconnect. AI's increasing power demands are pushing the limits of traditional air cooling, making 100% direct liquid cooling (DLC) a standard. xFusion offers cooling solutions with over 4000 watts of cooling capacity per chip.

For power, the company is advancing an 800V high-voltage DC architecture (HVDC) that significantly reduces power delivery losses. Furthermore, the increasing bandwidth demands of data centers are driving a transition to optical interconnects, such as co-packaged optics (CPO), enabling the density required for AI clusters.