Xi'an E-hope and Li Auto Sign New Strategic Cooperation Agreement
Xi'an E-hope Electronic Technology and Li Auto have signed a new strategic cooperation agreement, marking the production of 8-inch silicon carbide (SiC) wafers. The collaboration expands to include vehicle thermal management systems.
Chinese semiconductor manufacturer Xi'an E-hope Electronic Technology (also known as XINLIN Integrated) and automotive company Li Auto have entered into a new strategic cooperation agreement. The partnership celebrates the successful rollout of 8-inch silicon carbide (SiC) wafer production, signaling a deepening collaboration.
The scope of the cooperation will extend from vehicle electric drive systems to include vehicle thermal management systems, according to company announcements. The partnership initially began in March 2024 with a strategic agreement focused on joint technological advancements in automotive-grade SiC. In February 2025, XINLIN Integrated achieved mass production of 6-inch SiC wafers, which were subsequently used in Li Auto's i-series high-voltage pure electric vehicles.
XINLIN Integrated is the first domestic company in China to achieve mass production of 8-inch SiC wafers. The company has proactively planned production capacity and continuously optimized its manufacturing processes. Through vertical integration of its supply chain and iterative upgrades to its production lines, it has successfully transitioned from 6-inch to 8-inch SiC wafer production.
The 8-inch SiC chips that have now rolled off the production line will soon enter the SOP (start of production) phase. This achievement represents another key milestone for the companies following the mass production of their 6-inch products. Moving forward, both parties will leverage this strategic upgrade as a new starting point to accelerate the scaled production of 8-inch SiC chips and continuously iterate on core SiC products, while simultaneously advancing cooperation in new areas.