xMEMS begins mass production of solid state µCooling chip
Microelectromechanical systems (MEMS) startup xMEMS has announced the start of mass production for its all-silicon µCooling solid-state active cooling chip. The chip uses ultrasonic motion for cooling.
MEMS startup xMEMS announced yesterday that its all-silicon µCooling solid-state active cooling chip has entered mass production. The company is now manufacturing the devices.
The xMEMS µCooling chip generates ultrasonic motion through the high-frequency expansion and contraction of thin-film piezoelectric material on silicon. Precision micro-valves on the chip convert this motion into high-speed air pulses, which move heat away from the source. The chip measures just 1.13mm thick and boasts an IP68 rating for dust and water resistance.
The models entering mass production are the mid-size XMC-2400 and the large-size XMC-4800. The XMC-2400 offers a flow rate of 28 ml/s and a backpressure of 1300 Pa, suitable for edge AI devices like XR glasses. The larger XMC-4800 provides a flow rate of 48 ml/s and a backpressure of 1100 Pa, targeting smartphones and data center SSDs.
This technology enables the development of thinner and more powerful devices where thermal management is critical. Solid-state active cooling offers potential advantages over traditional cooling methods, including reduced size, quieter operation, and increased durability.